In-situ apparatus for semiconductor process module

ABSTRACT

Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/103,531 filed Aug. 14, 2018, which claims benefit of U.S. ProvisionalPatent Application Ser. No. 62/561,463 filed Sep. 21, 2017, each ofwhich is incorporated herein by reference in its entirety.

BACKGROUND Field

Aspects of the present disclosure generally relate to apparatuses andmethods for edge ring replacement in processing chambers, such as thoseused in semiconductor processing.

Description of the Related Art

In processing chambers, such as etch chambers, substrates are etchedwhile electrostatically clamped in position. Typically, a circular part,referred to as an edge ring, is positioned immediately outside of theouter diameter of the substrate to protect the upper surface of theelectrostatic chuck from being etched by etchant chemistry. Edge ringsare made from several different materials and can have different shapes,both which affect process uniformity near the edge ring. Duringprocessing, edge rings are etched over time thereby resulting in shapechanges as well as changes in processing uniformity.

To address the changes in processing uniformity due to edge ringdeterioration, edge rings are changed according to a schedule.Conventionally, to replace an edge ring, processing chambers are openedto allow an operator to have access to the edge ring inside. However,this process is time consuming, and due to venting of the processingchambers, may take up to 24 hours to get processing back online.

Therefore, there is a need for new methods and apparatuses for replacingedge rings.

SUMMARY

Aspects of the present disclosure generally relate to apparatuses andmethods for edge ring replacement in processing chambers.

In one aspect, a carrier for supporting an edge ring includes a platehaving a perimeter including two opposing curved edges. The carrierfurther includes a first plurality of receptacles disposed in the platewith each configured to receive a lift pin therein, and a secondplurality of receptacles disposed in the plate with each configured toengage a supporting structure. A first arcuate support structure iscoupled to one of the two opposing curved edges, the first arcuatesupport structure extending above a plane of an upper surface of theplate. A second arcuate support structure is coupled to the other of thetwo opposing curved edges, the second arcuate support structureextending above the plane of the upper surface of the plate.

In another aspect, a robot blade includes a base and two fingersextending from the base. A base carrier engagement feature is coupled toan upper surface of the base, and finger carrier engagement features areeach coupled to an upper surface of a respective one of the two fingers.

In another aspect, a method of transferring an edge ring includesinserting a robot blade into a chamber through a slit valve door, therobot blade having a carrier and an edge ring thereon, positioning thecarrier and the edge ring thereon over a substrate support, actuatingsubstrate lift pins to lift the carrier from the robot blade, andretracting the robot blade from the chamber.

In another aspect, a carrier for supporting an edge ring comprises asemi-circular plate. The semi-circular plate has a perimeter defined bytwo parallel edges and two opposing curved edges coupling the twoparallel edges. A first plurality of receptacles is disposed in thesemi-circular plate, each receptacle configured to receive a lift pintherein. A second plurality of receptacles is disposed in thesemi-circular plate, each receptacle configured to engage a supportingstructure. A first arcuate support structure is coupled to one of thetwo opposing curved edges. The first arcuate support structure extendsabove a plane of an upper surface of the semi-circular plate. A secondarcuate support structure is coupled to one of the two opposing curvededges, the second arcuate support structure extending above the plane ofthe upper surface of the semi-circular plate.

In another aspect, a robot blade comprises a base and two fingersextending from the base. The robot blade also includes two end pads,wherein one of the two end pads is disposed at each distal end of one ofthe two fingers. The robot blade also includes a base pad coupled to thebase, and a roller configured to actuate from the base towards the twofingers.

In another aspect, a robot blade comprises a base having an elevatedridge formed on an upper surface thereof, and two fingers extending fromthe base. Each finger has elevated ridges formed on upper surfacesthereof at respective distal ends thereof, wherein the elevated ridgesformed on upper surfaces of the two fingers and the elevated ridgeformed on an upper surface of the base are arcs of a common circle. Therobot blade also includes a plurality of engagement posts, wherein oneof the plurality engagement posts is formed on an upper surface of thebase, and one of the plurality of engagement posts is formed on uppersurfaces of each of the two fingers.

In another aspect, a method of transferring an edge ring comprisesinserting a robot blade into a chamber through a slit valve door, therobot blade having a carrier and an edge ring thereon. The carrier andthe edge ring thereon are positioned over a substrate support, andsubstrate lift pins are actuated to lift the carrier from the robotblade. The robot blade is retracted from the chamber, and the substratelift pins are actuated to lower the carrier toward the substratesupport. A second set of lift pins are actuated to lift the edge ringfrom the carrier, and the robot blade is inserted in the chamber andengages the carrier. The carrier and the robot blade are removed fromthe chamber, and the edge ring is lowered into contact with thesubstrate support.

In another aspect a support structure for supporting a substrate carriercomprises a base having a first end and a second end, and a cross memberdisposed at the first end of the base. The cross member is disposed in asame plane as the base and having a width greater than the base. Thecross member includes an opening formed therethrough, and at least twosupport posts extending from a surface of the cross member, the at leasttwo support posts positioned on opposite sides of the opening. Thesupport structure also includes a vertical member extending from thesecond end of the base. The vertical member extends in a directionopposite to the at least two support posts of the cross member. Thevertical member includes a ball bearing or contact pad at one endthereof.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toaspects, some of which are illustrated in the appended drawings. It isto be noted, however, that the appended drawings illustrate onlyexemplary aspects and are therefore not to be considered limiting ofscope, as the disclosure may admit to other equally effective aspects.

FIG. 1 illustrates a processing system, according to one aspect of thedisclosure.

FIG. 2A is a schematic top plan view of a carrier, according to oneaspect of the disclosure. FIG. 2B is a schematic bottom plan view of thecarrier of FIG. 2A. FIGS. 2C-2F are schematic sectional views of thecarrier of FIG. 2A.

FIG. 3A is a schematic top plan view of a carrier supporting an edgering thereon. FIG. 3B is a schematic sectional view of FIG. 3A.

FIGS. 4A and 4B are schematic top and bottom plan views, respectively,of a robot blade supporting a carrier thereon, according to one aspectof the disclosure. FIGS. 4C and 4D are schematic sectional views of arobot blade supporting a carrier thereon, according to one aspect of thedisclosure.

FIG. 5A is a schematic perspective view of a robot blade, according toone aspect of the disclosure.

FIG. 5B is a schematic sectional view of the robot blade of FIG. 5Asupporting a carrier, according to one aspect of the disclosure.

FIGS. 6A-6I schematically illustrate placement of an edge ring within aprocessing chamber, according to one aspect of the disclosure.

FIG. 7 is a flow diagram of a method of placing an edge ring, accordingto one aspect of the disclosure.

FIG. 8A is a schematic illustration of a carrier in a degassing chamber.

FIGS. 8B and 8C are schematic perspective views of a support finger,according to aspects of the disclosure.

FIG. 9 discloses a cassette, according to one aspect of the disclosure.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of one aspectmay be beneficially incorporated in other aspects without furtherrecitation.

DETAILED DESCRIPTION

Aspects of the present disclosure generally relate to apparatuses andmethods for edge ring replacement in processing chambers. In one aspect,a carrier for supporting an edge ring is disclosed. In another aspect,one or more robot blades for supporting a carrier are disclosed. Inanother aspect, a support structure for supporting a carrier in adegassing chamber is disclosed. In yet another aspect, a method oftransferring an edge ring on a carrier is disclosed.

FIG. 1 illustrates a processing system 100, according to one aspect ofthe disclosure. The processing system 100 includes a factory interface101 to which a plurality of substrate cassettes 102 may be coupled fortransferring substrates into the processing system 100. The processingsystem 100 also includes first vacuum ports 103 a, 103 b coupling thefactory interface 101 to respective degassing chambers 104 a, 104 b.Second vacuum ports 105 a, 105 b are coupled to respective degassingchambers 104 a, 104 b and disposed between the degassing chambers 104 a,104 b and a transfer chamber 106 to facilitate transfer of substratesinto the transfer chamber 106. The transfer chamber 106 includes aplurality of processing chambers 107 disposed therearound and coupledthereto. The processing chambers 107 are coupled to the transfer chamber106 through respective ports 108, such as slit valves or the like. Acontroller 109 controls various aspects of the processing system 100.

The processing chambers 107 may include or more of etch chambers,deposition chambers (including atomic layer deposition, chemical vapordeposition, physical vapor deposition, or plasma enhanced versionsthereof), anneal chambers, and the like. Some of the processing chambers107, such as etch chambers, may include edge rings therein, whichoccasionally require replacement. While conventional systems requiredisassembly of a processing chamber by an operator to replace an edgering, the processing system 100 is configured to facilitate replacementof edge rings without disassembly of a processing chamber 107 by anoperator.

FIG. 1 schematically illustrates transfer of an edge ring 110 into aprocessing chamber 107. According to one aspect of the disclosure, anedge ring 110 is removed from a cassette 102 via factory interface robot111 located in the factory interface 101, or alternatively, is loadeddirectly into the factory interface 101. The factory interface robot 111transfers the edge ring 110 through one of the first vacuum ports 103 a,103 b and into a respective degassing chamber 104 a, 104 b. A transferchamber robot 112 located in the transfer chamber 106 removes the edgering 110 from one of the degassing chambers 104 a, 104 b through asecond vacuum port 105 a or 105 b. The transfer chamber robot 112 movesthe edge ring 110 into the transfer chamber 106, where the edge ring 110may be transferred to a desired processing chamber 107 though arespective port 108. While not shown for clarity in FIG. 1 , transfer ofthe edge ring 110 occurs while the edge ring 110 is position on acarrier.

FIG. 1 illustrates one example of edge ring transfer, however, otherexamples are also contemplated. For example, it is contemplated that anedge ring may be manually loaded into the transfer chamber 106. From thetransfer chamber 106, the edge ring 110 may be loaded into a processingchamber 107 by the transfer chamber robot 112. Additionally oralternatively, edge rings may be loaded in a substrate support pedestal(SSP). An additional SSP may be positioned in communication with thefactory interface 101 opposite the illustrated SSP. It is contemplatedthat a processed edge ring 110 may be removed from the processing system100 in reverse of any manner described herein. When utilizing two SSPsor multiple cassettes 102, it is contemplated that one SSP or cassette102 may be used for unprocessed edge rings 110, while another SSP orcassette 102 may be used for receiving processed edge rings 110.

FIG. 2A is a schematic top plan view of a carrier 213, according to oneaspect of the disclosure. FIG. 2B is a schematic bottom plan view of thecarrier 213 of FIG. 2A. FIGS. 2C-2F are schematic sectional views of thecarrier 213 of FIG. 2A. The carrier 213 is a semi-circular plate 216having a perimeter defined by two parallel edges 214 a, 214 b and twoopposing curved edges 215 a, 215 b coupling the two parallel edges 214a, 214 b. The curved edges 215 a, 215 b facilitate lateral support of anedge ring positioned thereon, while the two parallel edges 214 a, 214 ballow the carrier 213 to be accommodated in processing chambers notoriginally designed to accommodate a carrier 213 therein. For example,the two parallel edges 214 a, 214 b facilitate actuation of lift pinswithin a processing chamber without interfering with the carrier 213while the carrier 213 is located within the processing chamber.

The semi-circular plate 216 includes a central opening 217 and one ormore semi-circular openings (three are shown) 218 a positionedconcentrically around the central opening 217. Additional semi-circularopenings 218 b are positioned concentrically about the one or moresemi-circular openings 218 a. The semi-circular openings 218 a, 218 bfacilitate a reduction in weight of the carrier 213, allowing thecarrier 213 to be used on existing transfer equipment not originallydesigned to handle weight in excess of semiconductor wafer weights. Inone example, the semi-circular plate 216 is formed from one or morematerials including carbon fiber, graphite, silicon carbide,graphite-coated-silicon-carbide, silicon nitride, silicon oxide,alumina, and the like. Other materials are also contemplated.

The semi-circular plate 216 also includes a first plurality ofreceptacles 219 disposed therein. The receptacles 219 are metallic capsdisposed in bores formed through the semi-circular plate 216. Thereceptacles 219 are sized and configured to receive a lift pin thereinto facilitate actuation of the carrier 213 within a processing chamber.The receptacles 219 are each located at the same radial distance from acenter of the semi-circular plate 216. In one example, the receptacles219 are positioned at a radius greater than a radius of thesemi-circular openings 218 a, but at a radius less than a radius of thesemi-circular openings 218 b.

FIGS. 2C and 2D are schematic sectional views of a receptacle 219. Thereceptacle 219 includes a body 220 having a cylindrical shape, and aflared base 221 at one end of the body. The body 220 is disposed throughthe semi-circular plate 216, while the flared base 221 is partiallypositioned in and contacts a counterbore formed on a lower surface ofthe semi-circular plate 216. The receptacle 219 includes a first recess222 extending into the body 220, and a counterbore 223 formed in theflared base 221. The recess 222 and the counterbore 223 are coupled by atapering sidewall 224 to facilitate feature engagement. In one example,the recess 222 has an oblong or parabolic shape to accommodate adiametrical alignment feature. In such an example, the recess 222 mayhave a greater width in a direction parallel to the two parallel edges214 a, 214 b, as opposed to a direction perpendicular to the twoparallel edges 214 a, 214 b. The parabolic or oblong shape of the recess222 facilitates accommodation of the lift pin within the recess 222.

The semi-circular plate 216 also includes a second plurality ofreceptacles 225 (three are shown) disposed therein. The receptacles 225are each configured to engage a supporting structure, such as a robotblade. Engagement of the receptacles 225 by the supporting structurereduces or prevents relative movement between the carrier 213 and thesupporting structure during transfer of the carrier 213. For example,the supporting structure may include corresponding male plugs to bereceived within the receptacles 225.

The receptacles 225 include a body 226 disposed in an opening formed inthe semi-circular plate 216. The receptacles 225 also include a flaredportion 227 disposed at one end of the body 226. The flared portion 227has a diameter greater than the body 226, and is partially disposed in acounterbore formed on the bottom side of the semi-circular plate 216. Abore 228 is formed through the body 226 and the flared portion 227, andincludes countersinks 229 at opposing ends thereof. The countersink 229on a lower end thereof facilitates guiding of a male plug into thereceptacle 225.

Each of the receptacles 219, 225 may be formed from one or more of ametal, silicon carbide, graphite, alumina, silicon nitride, siliconoxide, polyethylene terephthalate, or a ceramic material. Othermaterials are also contemplated. In one example the receptacles 219, 225are formed from a soft polymer material, such as Vespel®, UItem®,acetal, PTFE, or a ceramic material such as silicon carbide, to reduceparticle generation.

The carrier 213 also includes a first arcuate support structure 230 acoupled to the semi-circular plate 216 at the curved edge 215 a, and asecond arcuate support structure 230 b coupled to the semi-circularplate 216 at the curved edge 215 b. Each of the first arcuate supportstructure 230 a and the second arcuate support structure 230 b isdisposed on an upper surface of the semi-circular plate 216. The firstarcuate support structure 230 a and the second arcuate support structure230 b extend above a plane of the upper surface of the semi-circularplate 216. In one example, each of the first arcuate support structure230 a and the second arcuate support structure 230 b have a length lessthan length of a corresponding curved edge 215 a, 215 b. Each of thefirst arcuate support structure 230 a and the second arcuate supportstructure 230 b may be formed from a material such as carbon fiber,polyethylene terephthalate, or graphite.

Each of the first arcuate support structure 230 a and the second arcuatesupport structure 230 b include male extensions 231 that engage openings232 formed through the semi-circular plate 216. FIG. 2F illustrates asection view of a male extension 231 and an opening 232. The extension231 engages the opening 232 and is maintained therein via aninterference fit. In one example, the openings 232, as well as the firstarcuate support structure 230 a and the second arcuate support structure230 b, are positioned radially outward of the receptacles 225. Each ofthe first arcuate support structure 230 a and the second arcuate supportstructure 230 b has a radius of curvature that is about equal to aradius of curvature of the curved edges 215 a, 215 b.

Referring back to FIG. 2F, each of the first arcuate support structure230 a and the second arcuate support structure 230 b include steppedsurfaces on radially outward edges thereof. Each stepped surfaceincludes a supporting surface 233 positioned approximately parallel toan upper surface of the semi-circular plate 216, and a vertical wall 234positioned radially inward of the supporting surface 233 and orientedabout perpendicular to an upper surface of the semi-circular plate 216.An edge ring (shown in FIG. 3A) engages the supporting surface 233 andthe vertical wall 234 while being supported on the carrier 213. In oneexample, the distance between vertical walls 234 of the opposing firstarcuate support structure 230 a and the second arcuate support structure230 b is about equal to an inner diameter of the an edge ring, therebyreducing or mitigating movement of the edge ring relative to the carrier213 during a transfer process. In one example, the vertical walls 234are positioned radially outward of the male extensions 231.

While FIGS. 2A-2F illustrate one example of a carrier 213, otherexamples are also contemplated. For example, the carrier 213 may have acompletely circular body, rather than semi-circular. Additionally oralternatively, the carrier may include circular openings rather thansemi-circular openings 218 a, 218 b. In another example, thesemi-circular openings 218 a, 218 b may be excluded. In such an example,the carrier 213 may be formed, at least partially, from carbon fiber, alight-weight composite material, or another high-strength, low-weight,vacuum-compatible material. In one example, the carrier 213 issymmetrical about one or more axis to mitigate imbalance during movementand placement of the carrier 213. In another example, the first arcuatesupport structure 230 a and the second arcuate support structure 230 binclude outer edges which taper inwards from a lower portion thereof toan upper portion, to facilitate engagement with and alignment of an edgering 110.

FIG. 3A is a schematic top plan view of a carrier 213 supporting an edgering 110 thereon. FIG. 3B is a schematic sectional view of FIG. 3A. Asshown in FIG. 3A and FIG. 3B, the edge ring 110 is disposed on andsupported by the first arcuate support structure 230 a and the secondarcuate support structure 230 b. A lower surface of the edge ring 110contacts the supporting surfaces 233, while a radially inward edge ofthe edge ring 110 contacts the vertical walls 234 of the first arcuatesupport structure 230 a and the second arcuate support structure 230 b.In the illustrated example, the edge ring 110 has an inner diameter lessthan an outer diameter of the first arcuate support structure 230 a andthe second arcuate support structure 230 b, and the edge ring 110 has anouter diameter greater than the outer diameters of the first arcuatesupport structure 230 a and the second arcuate support structure 230 b.Additionally, an upper surface of the edge ring 110 disposed above uppersurfaces of the first arcuate support structure 230 a and the secondarcuate support structure 230 b. In one example, one or both of thefirst arcuate support structure 230 a and the second arcuate supportstructure 230 b may include a feature, such as a flat surface, forengaging an electrostatic chuck or other substrate support to facilitatealignment therewith.

FIGS. 4A and 4B are schematic top and bottom plan views, respectively,of a robot blade 435 supporting the carrier 213 thereon, according toone aspect of the disclosure. FIGS. 4C and 4D are schematic sectionalviews of the robot blade 435 supporting the carrier 213 thereon,according to one aspect of the disclosure. The robot blade 435 may beused on the factory interface robot 111. However, other uses are alsocontemplated.

The robot blade 435 includes a base 436 and one or more fingers 437(e.g., two fingers 437 are shown) extending from the base 436. In theexample shown, the fingers 437 are palmated, but it is contemplated thatdiscrete fingers 437 may be utilized. The base 436 may be coupled to anactuating arm of a robot to facilitate movement of the robot blade 435.In one or more embodiments, a robot blade in accordance with the presentdisclosure may include one or more carrier engagement features tofacilitate engaging and supporting the carrier 213 with a robot blade.For example, a robot blade may include a base carrier engagementfeature, such as coupled to or formed on an upper surface of the base ofthe robot blade, and finger carrier engagement features, such as coupledto or formed on an upper surface of each finger of the robot blade. Inthe example shown, the robot blade 435 includes an end pad 438 disposedat a distal end of each finger 437 for carrier engagement features. Therobot blade 435 also includes one or more base pads 439 (e.g., two pads439 are shown) coupled to an upper surface the base 436 as a basecarrier engagement feature. A roller 440 is also included with the robotblade 435 and is configured to actuate inward and outward (e.g.,laterally) to/from the base 436 towards the two fingers 437. The roller440 is coupled to a sliding member 441 that moves relative to the base436. The roller 440 may rotate about a post or may be a non-rotatingmember, such as a bumper. An actuator (not shown) is configured toactuate the sliding member 441 and the roller 440 towards a distal endof the finger 437 to facilitate securing of the carrier 213. Withreference to FIG. 4D, the roller 440 is shown in a non-contact position,but may be actuated into contact with an outer edge of the carrier 213to facilitate securing of the carrier 213. In a contact position of theroller 440 and the carrier 213, a gap is present between a bottomsurface of the edge ring 110 and an upper surface of the roller 440 sothat roller 440 may actuate without contacting the edge ring 110,thereby reducing damage to the edge ring 110 as well as reducingparticle generation.

The roller 440 is positioned between two base pads 439 disposed adjacentto or abutting the base 436. An upper surface 490 of each base pad 439is a supporting surface for the carrier 213. Each base pad 439 includesa planar lower surface 442 disposed on an upper surface of the fingers437 (or a palm thereof) at a proximal end thereof. The upper surface 490of each base pad 439 includes a step 443 adjacent the base 436, and atapered portion 444 tapering downward from the step 443 towards a distalend of the fingers 437. In one example, the carrier 213 rests upon thetapered portion 444 of the upper surface 490 during transport.

The fingers 437 additionally include end pads 438 disposed at distalends thereof. The end pads 438 are formed from the same or similarmaterial as the base pads 439. The end pads 438 facilitate support ofthe carrier 213 at or near the end of the fingers 437, and are sized andshaped to maintain the carrier 213 parallel to the fingers 437 duringtransport of the carrier 213. In one example, the end pads 438 include aplanar lower surface 445 in contact with the fingers 437, and an uppersurface having a planar portion 446 a, which contacts the carrier 213,and a tapered portion 446 b, proximal the planar portion 446 a. In oneexample, a height of the base pads 439 and the end pads 438 are selectedto provide spacing between a lower surface of receptacles 225 and anupper surface of the fingers 437.

In one example, the roller 440, each end pad 438, and each base pad 439is a padded material to reduce damage to the carrier 213. In anotherexample, the roller 440, each end pad 438, and each base pad 439 isformed from silicon oxide, silicon nitride, silicon carbide, orpolyethylene terephthalate. The fingers 437 and the base 436 may beformed from a metal or metal alloy, such as aluminum, or a ceramicmaterial, such as silicon carbide.

FIG. 5A is a schematic view of a robot blade 548 and a robot wrist 549,according to one aspect of the disclosure. FIG. 5B is a sectional viewof the robot blade 548 of FIG. 5A supporting the carrier 213 and theedge ring 110, according to one aspect of the disclosure. In one aspect,the robot blade 548 is configured to be coupled to existing robotwrists, or may be coupled to the robot wrist 549 by one or morefasteners 550, such as bolts. In turn, the robot wrist 549 may becoupled to a robot to facilitate movement of the robot blade 548. In oneexample, the robot blade 548, and optionally the robot wrist 549, may beutilized with the transfer chamber robot 112 (shown in FIG. 1 ).

The robot blade 548 includes a base 551 adjacent a distal end of therobot wrist 549. The base 551 has an elevated ridge 552 formed on anupper surface thereof. In one example, the elevated ridge 552 includes astepped surface (not shown). The stepped surface may engage a carrier213 during a transport operation to facilitate support of a carrier 213,thereby providing extra support to the carrier 213. The robot blade 548also includes two fingers 554 extending from the base 551. Each finger554 has an elevated ridge 555 formed on an upper surface thereof atrespective distal ends thereof. Each elevated ridge 555 extendsperpendicularly from the upper surface of each finger 554.

The elevated ridges 555 of the fingers 554 and the elevated ridge 552 ofthe base 551 are configured in semi-circular or curved arrangement. Inone example, the elevated ridges 555 formed on the upper surfaces of thetwo fingers 554 and the elevated ridge 552 formed on an upper surface ofthe base 551 are arcs of a common circle. In such an example, the commoncircle may be about the same size as the carrier 213 to facilitatesupport of the carrier 213.

In addition to or as an alternative to support provided by the elevatedridge 552 and the elevated ridges 555, the robot blade 548 may include aplurality of carrier engagement features, such as a plurality ofengagement posts 556 (three are shown). In one example, the engagementposts 556 are cylindrical columns extending perpendicularly from anupper surface of the robot blade 548. The base 551 includes one of theengagement posts 556 formed on an upper surface thereof adjacent theelevated ridge 552, while each of the two fingers 554 includes arespective engagement post 556 disposed on a respective upper surfacethereof.

As illustrated in FIG. 5B, each engagement post 556 is positioned toengage a corresponding receptacle 225 of the carrier 213. Engagement ofthe receptacles 225 by the engagement posts 556 reduces relativemovement between the robot blade 548 and the carrier 213 duringtransport of the carrier 213. When the receptacles 225 are engaged bythe engagements posts 556, an upper surface of the robot blade 548 isspaced from a lower surface of the semi-circular plate 216 of thecarrier 213. The dimensions of the receptacles 225 are selected toprovide a gap between the upper surface of the robot blade 548 and thelower surface of the semi-circular plate 216, thereby reducing contactbetween components and resulting in decreased particle generation.

In addition, the dimensions of the receptacles 225 may be selected tospace a lower surface of the edge ring 110 from an upper surface of theelevated ridge 552 and the elevated ridges 555, thereby reducing oreliminating contact between the edge ring 110 and the robot blade 548.The reduced contact between the edge ring 110 and the robot blade 548mitigates damage to the edge ring 110 caused by inadvertent contact withthe robot blade 548. Similarly, it is to be noted that the dimensions ofthe robot blade 548 may be selected to maintain spacing between an edgering 110 and the robot wrist 549, for similar reasons.

In some examples, the robot blade 548 may include one or more openings557 formed therein. The one or more openings 557 facilitate weightreduction of the robot blade 548, thereby compensating for the weight ofthe carrier 213. In doing so, the robot blade 548 can be retrofitted toexisting robots not originally designed for transfer of a carrier 213.In one example, the robot blade 548 may also be used to transfersubstrates. In such an example, the engagement posts 556 may includerounded upper surfaces to minimize contact with the substrate beingtransferred, thereby reducing particle generation.

FIGS. 6A-6H schematically illustrate placement of an edge ring 110 within a processing chamber 107, according to one aspect of the disclosure.FIG. 7 is a flow diagram of a method 760 of placing an edge ring,according to one aspect of the disclosure. To facilitate explanation,FIG. 7 is explained in conjunction with FIGS. 6A-6H.

FIG. 6A schematically illustrates a top perspective view of an interiorof a processing chamber 107. The processing chamber 107 includes a port108, such as a slit valve, to facilitate ingress and egress of a robotblade 548 and robot wrist 549. In operation 761 of method 760, a carrier213 having an edge ring 110 thereon is positioned in a processingchamber 107 via the robot blade 548. The carrier 213 and the edge ring110 are centered over an electrostatic chuck of a substrate support 680,as shown in FIG. 6A. The dimensions of the carrier 213 are selected toallow the carrier 213 and the edge ring 110 to pass through the port 108without requiring dimensional changes to the port 108. Thus, the carrier213 can be used on existing chambers without the need to significantlyreconfigure dimensions of the processing chamber 107. However, it iscontemplated that dimensional changes to the port 108 may occur toprovide additional clearance for ingress and egress of the carrier 213.

In operation 762, as shown in FIG. 6B, substrate lift pins 681 (e.g., afirst set of lift pins) are actuated into contact with receptacles 219of the carrier 213. In one example, three (3) substrate lift pins 681are actuated such that each substrate lift pin 681 engages a respectivereceptacle 219. The substrate lift pins 681 and the receptacles 219 arepositioned to allow engagement therebetween without interference fromthe robot blade 548. Subsequently, in operation 763, the substrate liftpins 681 are actuated further upward to lift the carrier 213 and theedge ring 110 supported thereon from the robot blade 548. In such aconfiguration, the carrier 213 and the edge ring 110 are positionedabove and separated from the robot blade 548, as shown in FIG. 6C.

In operation 764, the robot blade 548 is withdrawn from the processingchamber 107, and the carrier 213 and the edge ring 110 are loweredtowards the substrate support 680, as shown in FIG. 6D. In one example,the carrier 213 is lowered to a position that is spaced from an uppersurface of the substrate support 680, but is below a horizontal plane ofthe robot blade 548 or the initial engagement position of operation 762.

In operation 765, outer lift pins 682 (e.g., a second set of lift pins),located radially outward of the substrate lift pins 681, actuate upward.The outer lift pins 682 are disposed below a lift ring 683, and thus,when actuated upward, elevate the lift ring 683 form a surface of thesubstrate support 680. The lift ring 683 is actuated upward via theouter lift pins 682 to contact a bottom surface of the edge ring 110, asshown in FIG. 6E. The lift ring 683 includes a stepped surface on aninner perimeter to receive the edge ring 110 therein. Alternatively, thelift ring 683 may include a tapered surface to facilitate alignment.

In operation 766, the edge ring 110 is lifted from the carrier 213, asshown in FIG. 6F. For reference, FIG. 6F shows a schematic side viewthat is rotated by about ninety degrees with respect to FIG. 6E to showa different cross-section of the carrier 213. The edge ring 110 islifted by actuating the lift ring 683 further upward with the outer liftpins 682. In operation 766, the carrier 213 remains positioned on thesubstrate lift pins 681 while the edge ring 110 is lifted therefrom. Insuch a configuration, the carrier 213 is positioned in a first plane,and the lift ring 683 and the edge ring 110 located thereon arepositioned in a second plane above the first plane. In one example, thecarrier 213 may also optionally be lifted upward to align the carrier213 with a port 108 to facilitate removal of the carrier 213 from theprocessing chamber 107. In such an example, the lift ring 683 and theedge ring 110 are still positioned above the carrier 213.

In operation 767, the carrier 213 is removed from the processing chamber107, as shown in FIG. 6G. The carrier 213 is removed by inserting therobot blade 584 back into the processing chamber 107 and lowering thecarrier 213 onto the robot blade 584 using the substrate lift pins 681.The substrate lift pins 681 are further lowered into the substratesupport 680 to reduce the likelihood of interference with the substratelift pins 681. With the carrier 213 positioned on the robot blade 584,the robot blade 584 is withdrawn from the processing chamber 107.

The parallel edges 214 a, 214 b (shown in FIG. 2A) provide clearancewith respect to the outer lift pins 682, allowing the carrier 213 to bewithdrawn from the processing chamber 107 while the outer lift pins 682remain extended in a vertically-lifted position. The carrier 213 can bewithdrawn separate from the edge ring 110, as described, thus leavingthe edge ring 110 in the processing chamber 107.

In operation 768, with the carrier 213 and the robot blade 584 removedfrom the processing chamber 107, the lift ring 683 and the edge ring 110are positioned on the substrate support 680, as shown in FIG. 6H. Insuch an example, the lift ring 683 is lowered downward via actuation ofthe outer lift pins 682 until the lift ring 683 is in contact with thesubstrate support 680, thus positioning the edge ring 110 in apredetermined location. In one example, the edge ring 110 may include analignment tab or other indexing feature to facilitate proper alignmentof the edge ring 110 on the substrate support 680.

In an alternative example to FIG. 6H, shown in FIG. 6I, the edge ring110 may be disposed on the substrate support 680 such that one or morelift pins 681 positions the edge ring 110 in a non-parallelconfiguration with respect to an upper surface of the substrate support680 for processing. For example, a lift pin 681 may lift one section ofthe edge ring 110 to a relative height (with respect to the substratesupport 680) greater than another section of the edge ring 110. In doingso, a plasma sheath adjacent the substrate support 680 is affected.Thus, the position of the edge ring 110 may be chosen to affect theplasma sheath in order to result in more uniform processing.

While FIG. 7 illustrates one example of a method of transferring theedge ring 110, other examples are also contemplated. For example, it iscontemplated that an edge ring 110 may be removed from the processingchamber 100 by performing the method 670 in reverse.

In addition, it is contemplated that aspects of the present disclosuremay be utilized to further adjust plasma uniformity. In one example, theouter lift pins 682 may adjust the planarity of the edge ring 110 withrespect to the substrate support 680 once the edge ring 110 ispositioned on the substrate support 680. For example, after operation768, small adjustments may be made to the plane of the edge ring 110 byadjusting the vertical position of one or more of the outer lift pins682 to affect the plasma sheath and/or chemistry in a specific locationnear the edge ring 110 (or a substrate being processed). In such anexample, substrate processing may occur with the edge ring 110 beingnon-planar with respect to a substrate surface.

FIG. 8A is a schematic illustration of the carrier 213 when in usewithin a degassing chamber, such as the degassing chamber 104 a (shownin FIG. 1 ). FIG. 8B and FIG. 8C are schematic perspective views of asupport structure 885 used within the degassing chamber, according toaspects of the disclosure.

The interior of the degassing chamber includes a plurality of supportstructures 885 (three are shown). The support structures 885 areconfigured to support substrates, such as semiconductor wafers, orcarriers thereon, during a degassing operation. The support structures885 are oriented and configured to support semiconductor wafers, whichgenerally have a circular shape, as well as the substrate carrier 213,which has a semi-circular shape.

Each support structure 885 includes a base 886 having a first end 887 aand a second end 887 b. A cross-member 888 is disposed at the first end887 a of the base 886. The cross-member 888 is disposed in the sameplane as the base 886, sharing a coplanar upper surface therewith. Thecross-member 888 has a width greater than the base 886 and is orientedperpendicular to the base 886. The cross-member 888 includes an opening889 formed therethrough, and at least two support posts 890 extendingfrom a lower surface of the cross member 888. The two support posts 890are positioned on opposite sides of the opening 889 and may have acylindrical shape. In one example, the support posts 890 are axiallymovable or adjustable with respect to the cross-member 888.

The support structure 885 also includes a vertical member 891 extendingfrom the second end 887 b of the base 886. The vertical member 891extends in a direction parallel to the axis of the support posts 890. Inone example, the vertical member 891 extends in a direction opposite tothe two support posts 890 relative to or from the base 886. The verticalmember 891 includes a ball bearing 892 at a distal end thereof. Inanother example, the vertical member 891 includes a contact pad at adistal end thereof. The ball bearing 891 (or contact pad) facilitatescontact with a substrate without marring the surface of the substrate.The contact pad or the ball bearing 892 may be formed from ceramic oranother material that mitigates particle generation. In one example, acontact pad or the ball bearing 892 is configured to support a substratethereon during processing.

During operation, a substrate, such as a semiconductor wafer, istransferred into the degassing chamber 104 a and positioned on supportstructures 885. Due to the size and shape of the substrate, thesubstrate is able to contact all ball bearings 892 of the supportstructures 895. However, due to the semicircular shape of a carrier 213,a carrier 213 is unable to contact all ball bearings 892 of the supportstructures 895. However, the carrier 213 is able to contact the uppersurface of the base 886 and the cross-member 888 of each supportstructure 885, thereby allowing the support structures to support bothsemiconductor substrates as well as the carriers 213.

Referring to FIG. 8A, to facilitate support of multiple substrates, theorientation of the support structures 885 is adjustable. In theillustrated example, two support members 885 are oriented such that thevertical member 891 is located radially inward, while a third supportmember 895 is oriented such that a respective vertical member 891 islocated radially outward (e.g., 180 degrees with respect to oneanother). It is contemplated that each support member 895 may be rotatedabout an axis of the opening 889 to position each support member 895 ina desired configuration. The support posts 890 may engage acorresponding receptacle to prevent further rotational movement of eachsupport member 895 when each support member 895 is in a desiredlocation.

FIGS. 8A-8C illustrate one aspect of the disclosure, however, otheraspects are also contemplated. In an alternative example, a degassingchamber 104 a may include more than three support structures 885.

FIG. 9 discloses a cassette 902, according to one aspect of thedisclosure. The cassette 902 is configured to house one or more carriers213 each having an edge ring 110 thereon (three of each are shown). Eachcarrier 213 is positioned on a comb 991, spaced from one another by adistance “D”. The distance D is selected to a desired amount of robotclearance within the cassette 902. Each comb 991 includes opposingsupport structures coupled to internal surfaces of a housing 992. Eachsupport structure includes a base 993 coupled to the housing 992, and anextension 994 that extends inward from a respective base 993 in astepped configuration.

Carriers 213 of the present disclosure have opposing parallel edges 214a, 214 b, and thus are not circular, which prevents support inconventional cassettes. However, the cassettes 902 of the presentdisclosure include extensions 994 extending radially inward to support arespective carrier 213 along the opposing parallel edges 214 a, 214 b.The stepped surface of each comb 991 prevents interference with an edgering 110 when supporting a carrier 213 thereon. In one example, the sizeand position of the bases 993 of the combs 991 may be selected to allowsupport of a substrate, such as semiconductor wafer, thereon. Thus, thecassette 902 may be used both for introducing the carrier 213 and edgering 110 to a processing system 100, as well as for introducingsubstrates to the processing system 100 for processing. In anotherexample, a conventional cassette may be modified to include theextensions 994.

Benefits of the disclosure include having the ability to replace an edgering without venting and opening a processing chamber. Because ventingis avoided, chamber uptime is improved and maintenance costs arereduced. Moreover, replacing an edge ring without opening a processingchamber enables selection of edge ring shape or material to optimizeperformance of a specific etch application. Because conventionalapproaches require a significant amount of time to exchange edge ringsfor specific applications, doing so with conventional systems isimpractical. However, because edge rings can be quickly exchanged orreplaced using aspects described herein, it is now feasible to swap edgerings as dictated by process parameters.

Moreover, processing uniformity is also improved by aspects describedherein. Because conventional approaches require significantly longer toreplace edge rings, the time between preventative maintenance of edgerings is maximized in conventional systems to mitigate downtime.However, doing so results in well-worn edge rings immediately prior tothe preventative maintenance. Because the shape and material of an edgering affects the plasma sheath and chemistry concentrations near theedge of the substrate being processed, processing uniform may decreasedue to the presence of a well-worn edge ring. However, because aspectsof the present disclosure allow edge rings to be quickly replaced whenbeginning to wear, edge rings can be replaced more frequently withoutsignificant downtime, thereby leading to greater process uniformity.

While aspects herein are described with respect to semi-circular platesand carriers, it is contemplated that the carriers may be completelycircular.

While the foregoing is directed to aspects of the present disclosure,other and further aspects of the disclosure may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

What is claimed is:
 1. A carrier for supporting an edge ring,comprising: a plate having a perimeter including a plurality of curvededges and a plurality of parallel edges; a plurality of inserts disposedin the plate, each insert formed of a polymer material and configured toengage a supporting structure; and a plurality of support structurescoupled to the plurality of curved edges, each respective supportstructure extending above a plane of an upper surface of the plate, andeach respective support structure comprising: a step formed on aradially outward edge of the respective support structure and disposedabove and below the plane of the upper surface of the plate, the step ofeach respective support structure comprising: a supporting surfacedisposed parallel to and below the upper surface of the plate, and anarcuate wall positioned radially inward of the supporting surface of therespective support structure and oriented perpendicular to and extendingabove the plane of the upper surface of the plate, the arcuate wall ofeach respective support structure extending perpendicularly to thesupporting surface of the respective support structure, and a maleextension positioned radially inward of the wall and extending into theplate.
 2. The carrier of claim 1, wherein the arcuate wall of eachrespective support structure has a radius of curvature that is less thanan inner radius of the edge ring.
 3. The carrier of claim 2, wherein thearcuate wall of each respective support structure is disposed at aradius relative to a center of the plate, and the radius is equal to orlesser than the inner radius of the edge ring.
 4. The carrier of claim1, wherein the plate is a semi-circular plate.
 5. The carrier of claim1, wherein at least some of the plurality of inserts are positionedradially inward of the plurality of support structures.
 6. The carrierof claim 1, wherein each insert comprises a body disposed in an openingformed in the plate.
 7. The carrier of claim 6, wherein the body of eachinsert comprises a flared portion having an outer diameter that islarger than a cylindrical portion of the body.
 8. The carrier of claim7, wherein the body of each insert further comprises a bore formedthrough the body.
 9. The carrier of claim 1, wherein the plate comprisesone or more openings formed therein.
 10. The carrier of claim 9, wherethe one or more openings comprises a plurality of openings, and at leastone of the plurality of inserts is positioned between two of theplurality of openings.
 11. A carrier for supporting an edge ring,comprising: a plate having a perimeter including a plurality of curvededges and a plurality of parallel edges; a plurality of inserts disposedin the plate, each insert formed of a polymer material and configured toengage a supporting structure; and a plurality of support structurescoupled to the plurality of curved edges, each respective supportstructure comprising: a step formed on a radially outward edge of therespective support structure, the step of each respective supportstructure comprising: a supporting surface, and an arcuate wallpositioned radially inward of the supporting surface of the respectivesupport structure and extending perpendicularly to the supportingsurface of the respective support structure.
 12. The carrier of claim11, wherein the arcuate wall of each respective support structure has aradius of curvature that is less than an inner radius of the edge ring.13. The carrier of claim 12, wherein the arcuate wall of each respectivesupport structure is disposed at a radius relative to a center of theplate, and the radius is equal to or lesser than the inner radius of theedge ring.
 14. The carrier of claim 11, wherein the plate is asemi-circular plate.
 15. The carrier of claim 11, wherein each insertcomprises a body disposed in an opening formed in the plate, and thebody of each insert comprises a flared portion having an outer diameterthat is larger than a cylindrical portion of the body.
 16. The carrierof claim 15, wherein the body of each insert further comprises a boreformed through the body.
 17. A method of transferring an edge ring,comprising: inserting a robot blade into a chamber through a slit valvedoor, the robot blade having a carrier thereon and an edge ringsupported on the carrier; positioning the carrier and the edge ringthereon over a substrate support; actuating substrate lift pins to liftthe edge ring from the carrier; and retracting the robot blade and thecarrier from the chamber; wherein the carrier comprises: a plate havinga perimeter including a plurality of curved edges and a plurality ofparallel edges; a plurality of inserts disposed in the plate, eachinsert formed of a polymer material and configured to engage asupporting structure; and a plurality of support structures coupled tothe plurality of curved edges, each respective support structurecomprising: a step formed on a radially outward edge of the respectivesupport structure, the step of each respective support structurecomprising: a supporting surface, and an arcuate wall positionedradially inward of the supporting surface of the respective supportstructure and extending perpendicularly to the supporting surface of therespective support structure.
 18. The method of claim 17, furthercomprising: lowering the edge ring into contact with the substratesupport.
 19. The method of claim 18, wherein lowering the edge ring intocontact with the substrate support includes positioning the edge ring ina non-parallel configuration with respect to an upper surface of thesubstrate support to adjust a position of a plasma sheath duringprocessing.
 20. The method of claim 17, wherein the inserts of thecarrier are engaged with the robot blade during the inserting the robotblade into the chamber and the retracting the robot blade and thecarrier from the chamber.